The exponential growth of AI workloads, GPU-accelerated computing, and next-generation IT architectures is reshaping the data centre landscape. Traditional air-cooled environments are reaching their limits as power densities surge.

Modern IT workloads from AI, machine learning, and high-performance computing to the rapid rise in AI token generation, are pushing power demands to unprecedented levels. Modern AI chips, such as NVIDIA's H100 and AMD's MI300, are engineered to handle intensive tasks like large language model training and inference. These chips can consume up to 700 watts each, leading to rack power densities exceeding 100kW. This significant heat output challenges conventional cooling methods, necessitating advanced solutions. Individual racks now consume 3–6× more power than previous generations, with AI GPU clusters drawing up to 600kW. per rack compared to just 5–15 kW for traditional deployments. This tremendous heat output makes liquid cooling essential for sustainable, high-performance infrastructure.

By directly targeting heat with liquid, data centres achieve greater cooling efficiency, enabling dense AI and cloud deployments to run faster and more reliably. Liquid cooling meets the stringent thermal requirements of next-gen chips, dramatically reduces cooling energy consumption, and drives improvements in power usage effectiveness (PUE). It also offers a strong total cost of ownership (TCO) advantage, helping future-proof infrastructure investments.

The pace of change is accelerating. AI infrastructure demands are here now, and facilities must be ready to meet them today. Advanced liquid cooling solutions are no longer optional. They are the foundation for sustaining the next generation of compute environments.